South Korea's two largest memory-chip companies are preparing to disclose sweeping investment plans next week, with ambitions spanning advanced semiconductor manufacturing, artificial intelligence data centres and other high-tech areas, according to a report published on Friday.
Samsung Group is said to be ready to announce a blueprint that could top 1,000 trillion won over a 10-year span - a commitment that, if confirmed, would represent an unprecedented scale of corporate capital deployment in South Korea. The reported total translates to roughly $646 billion.
The announcements are expected to be made at a national economic briefing convened by President Lee Jae Myung on June 29, where senior executives from major companies will lay out development-linked investment plans. Named executives expected to attend include Samsung Electronics Vice Chairman Jun Young-hyun and SK Hynix Chief Executive Kwak Noh-jung.
According to the report, Samsung's projected spending would cover several technology areas: semiconductors, AI data centres, batteries and displays. A sizeable portion of the funds would be allocated to new chipmaking facilities and upgraded advanced packaging operations. Specific regional plans mentioned include roughly 300 trillion won proposed for semiconductor plants in the country's southwest and more than 350 trillion won envisioned for AI data centre projects.
Separately, SK Hynix announced plans this week to raise up to $29.4 billion through an American Depositary Receipt listing on Nasdaq. Proceeds from the potential ADR offering are earmarked for new semiconductor fabrication plants, advanced packaging facilities and purchases of chipmaking equipment.
Market reaction to the reports was negative in early Asian trading. By 02:55 GMT, shares of the Seoul-listed companies were trading lower amid a broader pullback in regional technology stocks, with both firms down by about 7% at that time.
Context and implications
The reported plans underline a strategic focus on expanding domestic capacity for semiconductors and AI infrastructure, with the announced capital directed toward buildout of physical manufacturing and data facilities and toward advanced packaging capabilities. For companies, regional policymakers and suppliers, the scale of proposed spending would have wide-ranging implications for construction, equipment procurement and related technology services.
Details on timing, financing structures and exact project sites remain subject to confirmation at the June 29 briefing and in subsequent company disclosures.