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Press Releases June 3, 2026 11:00 AM

Vishay Intertechnology 200 A Power Module Saves Space, Lowers Conduction Losses, and Increases Reliability in MHEVs and LEVs

Vishay launches new 200 A power module enhancing efficiency and saving space for hybrid and electric vehicle applications

By Marcus Reed
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Vishay Intertechnology introduces the VS-HOT200C080, a 200 A power module that reduces board space by 15% and lowers conduction losses by 32% for 48 V traction inverters used in mild hybrid and light electric vehicles. The module integrates MOSFETs, a shunt resistor, bypass capacitors, and temperature sensing in a compact, reliable package meeting stringent automotive reliability standards.

Vishay Intertechnology 200 A Power Module Saves Space, Lowers Conduction Losses, and Increases Reliability in MHEVs and LEVs
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Key Points

  • The VS-HOT200C080 module reduces board space requirements by up to 15%, aiding compact design in MHEV and LEV applications.
  • Features MOSFETs with best-in-class on-resistance of 0.45 mΩ, cutting conduction losses by 32%, enhancing power efficiency.
  • The module supports wide temperature operation (-55°C to +175°C) and meets AQG-324 reliability standards, important for automotive applications.

MALVERN, Pa., June 03, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new 200 A power module designed to save space and increase efficiency in 48 V traction inverters for light electric vehicles (LEV) and belt-start generator / recuperation systems for mild-hybrid electric vehicles (MHEV).

For these applications, the Vishay Semiconductors VS-HOT200C080 reduces board space requirements by up to 15 % compared to standard discrete solutions. To increase efficiency, the integrated power module’s MOSFETs feature best in class on-resistance of 0.45 mΩ, reducing conduction losses by 32 % compared to competing solutions.

The device released today integrates 80 V MOSFETs in a half-bridge configuration, a shunt resistor for current reading, bypass capacitors for improved switching performance, and an NTC for temperature sensing — all in an insulated 30 mm x 22.8 mm transfer-mold FlatPAK HC0 package with an electrically isolated exposed DBC substrate.

The power module’s transfer-mold technology enables highly reliable performance over a wide operating temperature range from -55 °C to +175 °C, especially during power cycling — allowing the device to meet severe AQG-324 reliability requirements. The VS-HOT200C080’s HC0 package features signal pins and power tabs at different heights. This allows designers to have separate power and signal PCBs, simplifying designs and allowing for better routing. To save additional board space, the signal and power PCBs can be stacked.

Samples and production quantities of the VS-HOT200C080 are available now, with lead times of 13 weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

Links to product datasheets:
http://www.vishay.com/ppg?97360  (VS-HOT200C080)

Link to product photo:
https://www.flickr.com/photos/vishay/albums/72177720334015734

For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
[email protected]
 or
Redpines
Bob Decker, +1 415 409-0233
[email protected]


Risks

  • Lead times for the product are currently 13 weeks, possibly affecting supply chain and customer adoption speed.
  • Strong competition in the semiconductor market for power modules could impact market share and pricing power.
  • Dependence on the automotive sector’s demand for MHEV and LEV technology, which could be vulnerable to shifts in regulatory or economic environments.

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