Overview
Samsung Group provided a site-level breakdown on Thursday of a major investment program totaling 140 trillion won, equivalent to $90 billion using the exchange rate $1 = 1,552.4000 won. The spending is designated for production linked to display panels, batteries, chips and chip materials in Chungcheong province, a central region of South Korea.
Company allocations and locations
Details announced at the event specify that Samsung Display will allocate 67 trillion won for projects in Asan and Cheonan. Samsung Electronics will invest 56 trillion won to construct packaging facilities for high-bandwidth memory (HBM) chips in Onyang and Cheonan. Samsung SDI has committed 9 trillion won by 2040 in Cheonan for production and research and development of next-generation batteries. Samsung Electro-Mechanics intends to invest 8 trillion won by 2040 in Sejong to produce advanced chip packaging materials for AI servers and to support domestic talent development.
Context of the announcement
Samsung Display CEO Yi Chung provided the detailed breakdown during an event hosted by President Lee Jae Myung on Thursday. The company said the plan aligns with larger investment commitments the group made public on Monday, with Thursday's presentation adding site-specific and company-level spending figures for Chungcheong.
Implications stated in the announcement
The disclosed investments cover multiple segments of Samsung Group's manufacturing footprint: display panel production, semiconductor packaging for high-bandwidth memory chips, battery production and R&D for next-generation cells, and materials manufacturing for advanced chip packaging aimed at artificial intelligence server applications. The timeline for two of the allocations - Samsung SDI and Samsung Electro-Mechanics - extends to 2040 as specified in the announcement.
Summary of figures
- Total investment for Chungcheong: 140 trillion won ($90 billion).
- Samsung Display: 67 trillion won in Asan and Cheonan.
- Samsung Electronics: 56 trillion won in Onyang and Cheonan for HBM packaging facilities.
- Samsung SDI: 9 trillion won by 2040 in Cheonan for next-generation battery production and R&D.
- Samsung Electro-Mechanics: 8 trillion won by 2040 in Sejong for chip packaging materials and talent development.
Note on sources and timing
The breakdown was provided by Samsung Display CEO Yi Chung at the presidential-hosted event on Thursday. The group said the detailed plan complements an earlier set of investment plans disclosed on Monday.