Press Releases June 8, 2026 08:15 AM

MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

MACOM launches innovative Hot Via Chip Scale Technology for improved semiconductor assembly and performance

By Nina Shah
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MTSI

MACOM Technology Solutions Inc. announced its new chip scale hot via process based on AlGaAs diode technology, aiming to eliminate traditional wire bonds. This technology simplifies surface mount assembly, reduces parasitics, and improves signal integrity up to millimeter wave frequencies. The first product utilizing this process, the MASW-011261 broadband SP2T switch, offers low insertion loss, high isolation, and fast switching speeds in a compact package.

MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds
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Key Points

  • Introduction of hot via technology eliminates wire bonds, simplifying assembly and enhancing manufacturing consistency.
  • The new process enhances high frequency performance and reliability, crucial for mmWave applications.
  • First product MASW-011261 broadband SP2T switch showcases the technology with low insertion loss and high isolation, targeting telecommunications and defense sectors.

LOWELL, Mass., June 08, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology. As an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies, MACOM’s hot via process simplifies surface mount assembly while delivering low insertion loss and high isolation.

Hot via technology enables direct surface mount attachment by routing RF signal and ground paths vertically through the die. By removing bond wires, customers can reduce assembly complexity, improve manufacturing consistency and minimize parasitics, thereby achieving high signal integrity and reliable performance into millimeter wave (mmWave) frequencies.

“MACOM continues to build on its deep expertise in microwave technologies to address our customers’ evolving performance and integration challenges. Our new hot via-based AlGaAs process can reduce assembly complexity while improving the high frequency performance of our integrated components,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.

Ideal for applications including switches, limiters and other control functions, the new process will be deployed on MACOM’s proven AlGaAs diode technology.

MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB isolation, and sub-20 ns switching speeds, all in a compact 1.87 mm x 1.98 mm chip scale package.

The MASW-011261 and MACOM’s hot via process will be on display at MACOM’s Booth #17035 at the International Microwave Symposium (IMS 2026) on June 9 to 11, 2026 in Boston, MA.

About MACOM

MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. To learn more, visit https://www.macom.com/.

Company Contact:
MACOM Technology Solutions Inc.
Stephen Ferranti
Sr. Vice President, Corporate Development and Investor Relations
P: 978-656-2977
E: [email protected]


Risks

  • Adoption risk: Customers need to transition from established wire bonding processes to the new hot via technology, which may slow market penetration.
  • Technological risk: The performance benefits depend on successful integration of hot via technology in various products and applications.
  • Market risk: Competition from other semiconductor packaging technologies could limit MACOM's market share expansion.

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