Stock Markets March 18, 2026

Samsung and AMD deepen AI memory supply ties, explore possible chipmaking pact

Memorandum of understanding centers on HBM4 for AMD’s MI455X accelerators and DDR5 for sixth-generation EPYC ‘Venice’; foundry cooperation also under consideration

By Hana Yamamoto AMD
Samsung and AMD deepen AI memory supply ties, explore possible chipmaking pact
AMD

Samsung Electronics and Advanced Micro Devices have signed a memorandum of understanding to expand collaboration on memory components for AI infrastructure, with Samsung set to supply next-generation HBM4 for AMD’s Instinct MI455X accelerators and optimized DDR5 for AMD’s sixth-generation EPYC processors codenamed 'Venice.' The companies are also investigating a potential foundry arrangement under which Samsung could manufacture future AMD chips.

Key Points

  • Samsung will supply HBM4 for AMD’s upcoming Instinct MI455X AI accelerators and provide optimized DDR5 for AMD’s sixth-generation EPYC 'Venice' CPUs - impacts the semiconductor memory and AI infrastructure sectors.
  • The companies are exploring potential foundry cooperation, which could see Samsung manufacturing future AMD chips as a contract supplier - relevant to foundry services and semiconductor manufacturing markets.
  • The move follows related industry developments, including a recent foundry disclosure involving Nvidia and Samsung, and Samsung’s push toward multi-year supply contracts to reduce demand volatility - affects capital equipment, data centre investment and supplier contract practices.

Samsung Electronics Co Ltd has formalized an agreement with Advanced Micro Devices Inc to broaden their cooperation on memory supplies tailored for AI computing, the companies said. The memorandum of understanding focuses on delivering Samsung’s next-generation high-bandwidth memory (HBM4) for AMD’s forthcoming Instinct MI455X accelerators and providing optimized DDR5 memory for AMD’s sixth-generation EPYC central processors, which carry the codename 'Venice.'

According to the announcement, these memory components are intended to underpin next-generation AI systems built from a combination of AMD Instinct GPUs, EPYC CPUs and rack-scale designs such as the Helios platform. The collaboration is positioned to support integrated server architectures that pair accelerators and CPUs at scale.

“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics.

Under the terms described, Samsung will act as a primary supplier of HBM4 for AMD’s next-generation AI GPUs. The South Korean company already supplies high-bandwidth memory to AMD, providing HBM3E chips that are used in the MI350X and MI355X accelerators. In addition to the memory supply aspects, the two firms said they will explore potential foundry cooperation. That potential arrangement would see Samsung produce future AMD chips on a contract-manufacturing basis if both sides agree to proceed.

The timing of the announcement follows industry developments at other major chipmakers. One day earlier, Nvidia disclosed a foundry partnership with Samsung at its annual GTC developer conference. At that event, Nvidia CEO Jensen Huang said Samsung is producing Nvidia’s latest AI chips and showcased processors manufactured using Samsung’s 4-nanometer process technology. The market response to the broader set of foundry and supply-chain developments was reflected in a more than 7% rise in Samsung’s share price on the news.

Separately, Samsung management has indicated a push toward more stable customer arrangements. Earlier in the same week, a Samsung co-CEO said the company is negotiating with major customers to shift toward multi-year contracts spanning three to five years, a move intended to mitigate demand volatility. Speaking at the annual shareholder meeting in Suwon, Co-CEO Jun Young-hyun said the chip industry is entering an "unprecedented supercycle" driven by rising investment in AI data centres and emphasized that Samsung must prepare for "various scenarios."


Summary: Samsung and AMD have agreed to deepen collaboration on memory for AI infrastructure, with Samsung to supply HBM4 for AMD’s MI455X accelerators and optimized DDR5 for EPYC "Venice" CPUs. The companies are also discussing a potential foundry partnership under which Samsung could manufacture AMD chips.

Risks

  • Potential uncertainty over whether the explored foundry partnership will be finalized - impacts semiconductor manufacturing and supplier planning.
  • Market reaction to foundry and supply announcements can be volatile, as illustrated by the share-price movement following related disclosures - affects equity markets tied to chipmakers and suppliers.
  • Shifts to multi-year contracts aim to smooth demand swings but may constrain flexibility for both suppliers and customers if conditions change - relevant to contract negotiation dynamics in the semiconductor industry.

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