Baird reports that lead times across a range of semiconductor product categories have moved higher, signaling an acceleration of an upcycle that began in late first quarter 2025. The firm’s data shows several components have reached the longest delivery windows seen in months or years.
MOSFETs now average about 25 weeks in lead time, the longest since July 2024. Within that category, certain suppliers show particularly stretched timelines: MOSFETs from Diodes are reportedly at 37 weeks, Vishay at 31 weeks, and Onsemi at 26 weeks.
Power conversion and related analogs are also seeing material lengthening. DC-to-DC converters from MPS are reaching roughly 33 weeks, a level last observed in October 2022. LCD driver IC lead times have risen to 25 weeks, the most prolonged waits since August 2023. Discrete diode products have extended to 26 weeks, returning to lead-time levels recorded in October 2022.
SiC, data conversion and amplifiers show mixed patterns. Onsemi’s silicon carbide (SiC) products are cited at about 24 weeks. The company’s data conversion and amplifier product lead times remain steadier, at approximately 17 weeks and 13 weeks, respectively.
FPGAs and memory have also seen marked increases. Xilinx FPGAs are listed at around 40 weeks, a stretch that brings them back to levels last seen in January 2023. DRAM lead times for both mobile LPDDR5 and DDR5 sit at approximately 41 weeks, the highest readings within Baird’s dataset.
Baird characterized these moves as part of an upcycle that has gained momentum since late first quarter 2025 and said it remains constructive on cyclical semiconductor companies.
Context and data limitations
The figures above reflect Baird’s reported lead-time observations across multiple product groups and select suppliers; they indicate where each category stands relative to prior months and, in several cases, to multi-year reference points. The reporting focuses on average lead times and supplier-specific examples provided by Baird.
Key points
- Lead times have increased across several semiconductor segments, accelerating an upcycle that began in late first quarter 2025.
- Notable stretches include MOSFETs (average 25 weeks), Xilinx FPGAs (40 weeks) and DRAM (LPDDR5 and DDR5 at 41 weeks).
- Power conversion and discrete analog parts - including DC-to-DC converters, LCD driver ICs and diodes - have returned to lead-time levels last seen in 2022 or 2023.
Risks and uncertainties
- Persisting long lead times could continue to affect production schedules for electronics manufacturers that rely on the listed components.
- Supplier-specific constraints appear uneven across categories and vendors, introducing uncertainty for purchasers who depend on particular brands or product lines.
- The dataset reflects Baird’s reported observations; broader market conditions or changes in demand and supply beyond those observations could alter lead times.
Impacted sectors
- Semiconductor manufacturing and distribution
- Electronics OEMs that use MOSFETs, DRAM, FPGAs and discrete analog components
- Supply-chain and inventory management functions within technology and consumer electronics firms